Company overview
Amkor Technology Malaysia Sdn. Bhd.
Registration Number
197301002216
Old Registration Number
15702-X
Name
Amkor Technology Malaysia Sdn. Bhd.
Entity type
Company
Incorporation date
1 January 1973
Country
Malaysia
Primary goods traded
- 66.5% — Epoxide resins (390730)
- 📐32.1% — Instruments, appliances and machines (903180)
- 0.8% — Plastics (392390)
- 🧠0.7% — Electronic integrated circuits (854231)
Main Trading Partners
| Partner | Type | Total Value | Percentage |
|---|---|---|---|
| Kyocera Asia Pacific Pte. Ltd. | seller | $1,226,245 | 43.56% |
| Sumitomo Bakelite Singapore Pte. Ltd. | seller | $666,897 | 23.69% |
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Trade Data
| Data Source | HS Code | Description | Buyer | Buyer Country | Seller | Seller Country | ||
|---|---|---|---|---|---|---|---|---|
| 10 July 2025 | PH | 90318090000 | New Die Attach (Da) D510 | On Semiconductor Philippines Inc | PH | Amkor Technology Malaysia Sdn Bhd | $902,846.53 | |
| 21 July 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $210,228.00 |
| 30 September 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $142,245.00 |
| 7 September 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $123,744.00 |
| 27 August 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $96,431.00 |
| 1 April 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $89,649.00 |
| 23 June 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $88,418.00 |
| 27 May 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $78,509.00 |
| 29 July 2020 | SG | 39073090 | Epoxy Molding Compound | Amkor Technology Malaysia Sdn Bhd | MY | Kyocera Asia Pacific Pte Limited | SG | $77,152.00 |
| 6 July 2020 | SG | 39073090 | Molding Compound "Sumikon" Resin Tablet | Amkor Technology Malaysia Sdn Bhd | MY | Sumitomo Bakelitte Singapore Pte Limited | SG | $53,949.00 |
0 of 20 row(s) selected.