A-Bond Technology Pte. Ltd.

UEN

200202528D

Name

A-Bond Technology Pte. Ltd.

Entity type

Local Company

Primary SSIC Description

MANUFACTURE OF GOLD AND OTHER METAL PRODUCTS INC. JEWELLERY

UEN Issue Date

27 March 2002

Secondary SSIC Code

71129

Secondary SSIC Description

MANUFACTURE OF GOLD AND OTHER METAL PRODUCTS INC. JEWELLERY

Status

Struck Off

Incorporation date

27 March 2002

Address

71, JALAN DERMAWAN

Postal Code

669022

Country

Singapore