Company overview
UEN
198905407G
Name
Asmpt Singapore Pte. Ltd.
Former names
ASM TECHNOLOGY SINGAPORE
Entity type
Local Company
Primary SSIC Description
DESIGN,PRODUCTION & MARKETING OF SEMICONDUCTOR EQUIPMENT & MATERIALS
UEN Issue Date
9 December 1989
Secondary SSIC Description
DESIGN,PRODUCTION & MARKETING OF SEMICONDUCTOR EQUIPMENT & MATERIALS
Status
Live Company
Incorporation date
9 December 1989
Address
2, YISHUN AVENUE 7
Postal Code
768924
Country
Singapore
Primary goods traded
| Data Source | HS Code | Description | Buyer | Buyer Country | Seller | Seller Country | ||
|---|---|---|---|---|---|---|---|---|
| 21 April 2025 | PH | 84869049000 | Gold Wire Ball Bonder | Ti Philippines Inc | PH | Asmpt Singapore Pte Limited | $2,565,000.00 | |
| 14 January 2025 | PH | 84869049000 | Gold Wire Ball Bonder | Ti Philippines Inc | PH | Asmpt Singapore Pte Limited | $2,090,400.00 | |
| 20 July 2020 | SG | 84864020 | Orcas Expandable 2 PressModel : Orcas-Ep2 | Jcet Semiconductor Shaoxing Company Limited | CN | Asm Advanced Packaging Materials Pte Limited | SG | $1,876,736.00 |
| 17 April 2020 | SG | 84864020 | Wire Ball Bonder Model : Ihawk Aero | Shanghai Shen Hang Import & Export Co Limited Usci No 91310115132225527K | CN | Asm Advanced Packaging Materials Pte Limited | SG | $1,593,850.00 |
| 4 August 2020 | SG | 84864020 | Wire Ball BonderModel : Ab383Brand : AsmQuantity : 10 SetsPacking : Ten Wooden CasesH S Code : 84864022Gross Weight : 690.0 Kgs / SetTotal Gross Weight : 6900.0 KgsInvoice No. 9020188529 | Shenzhen Bada Logistics Company Limited | CN | Asm Advanced Packaging Materials Pte Limited | SG | $1,387,618.00 |
| 26 June 2020 | SG | 85429000 | Lead FrameInvoice No: 9542014310 / 9542014311 / 9542014312 / 9542014314 | Nanotech Semiconductor | TW | Asm Advanced Packaging Materials Pte Limited | SG | $1,311,410.00 |
| 30 May 2020 | SG | 84864020 | Gold Wire Ball BonderModel : Aerocam-I | Kunshan Q Technology Limited | CN | Asm Advanced Packaging Materials Pte Limited | SG | $1,214,148.00 |
| 21 January 2025 | PH | 84864020000 | Common Platform Max Bonder | Ti Philippines Inc | PH | Asmpt Singapore Pte Limited | $1,000,000.00 | |
| 31 January 2024 | PH | 85158090000 | 12 High Speed Epoxy Die Bonder | Ti Philippines Inc | PH | Asmpt Singapore Pte Limited | $997,320.00 | |
| 25 April 2024 | PH | 85437090000 | Asmpt 3Ge 170T 3 Press System With Air Floater (Standalone Complete With Accessories) 1 Set | Allegro Microsystems Philippines Inc | PH | Asmpt Singapore Pte Limited | $940,000.00 |
| Partner | Type | Total Value | Percentage |
|---|---|---|---|
| Quanzhou Sanan Semiconductor Technology Co., Ltd. | buyer | $2,323,177 | 1.76% |
| Sumec International Technology Co., Ltd. | buyer | $2,087,247 | 1.58% |
| Galaxycore Zhejiang Ltd. Corp. | buyer | $1,957,057 | 1.48% |