Company overview
Business Registration Number
16130009
Name
Chipbond Technology Corporation
Official Name
頎邦科技股份有限公司
Entity type
Company Limited by Shares
Authorized capital
$7,445,935,390
Phone
+8860356787881201
Representative
吳非艱
Industry codes
261300 - Packaging and Testing of Semi-conductors
Incorporation date
6 July 1998
Address
No. 3, Lixing 5th Rd., East Dist., Hsinchu City 30078
Country
Taiwan